Thermal Management for Airborne Electronics

Overview

General Lattice partnered with DEVCOM AvMC to design and fabricate thermal management inserts for airborne electronics enclosures. Using computational design, the team optimized lattice geometries for maximum heat dissipation while meeting strict weight budgets and volume constraints imposed by existing enclosure architectures.

Scope

• Thermal simulation and lattice geometry optimization
• Design for additive manufacturing constraints
• Prototype fabrication and thermal testing
• Integration with existing enclosure platforms